CFD prediction of heating uniformity in furnaces and ovens allows you to quantify thermal stresses within individual wafers or within a wafer stack. With parametric modeling capability, you can quickly determine the effect of changing wafer diameter, stack spacing, or throughput rate, and optimize your furnace for reduced defects.

Thermal gradients in a wafer stack in a diffusion/oxidation furnace reveal non-uniform heating during the heat-up cycle.