Since 1996, Icepak software has been addressing the specific needs of electronics designers. Its ability to help designers understand and favorably manipulate their designs for maximum cooling is becoming world renowned. In just 4 short years, Icepak has gone from a startup product to having an estimated 40 percent of the U.S. market share for electronics cooling software.

The newest version, Icepak 3.0, was released this summer. Icepak 3.0 has added parametric design capabilities, so the user can automate the software to consider several design options quickly. Solver speed has increased. Icepak uses FLUENT as its core solver engine. It also features extended parallel processing. A downloadable library of models for fans, heat sinks, and IC packages also contributes to Icepak’s ease of use and speed to solution.

For more information on Icepak, visit www.icepak.com

FluentNEWS