IcePak, Fluent's specialty CFD product for electronics cooling applications, continues to evolve at a fast pace. Jointly developed by Fluent and ICEM CFD, new releases of IcePak are delivering on our commitment to make Fluent's latest core CFD technology available for electronics thermal management.

Version 2.1, released in October 1997, delivered dramatic speed improvements by incorporating the solver engine from FLUENT/UNS. An average of 7.5X faster during regression testing at Fluent, Version 2.1 is delivering even greater speed in the hands of users.

The upcoming Version 2.2 release will deliver more flexible model building capability, with tetrahedral as well as hexahedral meshes supported. "Tetrahedral meshes can handle extremely complex geometries," states Rajesh Nair, Fluent's IcePak Product Manager. "The combination of automated hex and tet meshing gives IcePak users two powerful tools, and better strategies for success, when confronted with difficult modeling." Additional advanced features, including parallel processing, are also slated for upcoming releases in which IcePak will inherit many of the capabilities Fluent has already provided in its general purpose CFD software.

Tetrahedral mesh used in IcePak 2.2 models a complex fan/heat sink with radial fins

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