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By Rajesh Nair, Icepak Product Manager
Icepak and IcePro By Rajesh Nair, Icepak Product Manager A benchmark
computer chassis solution, computed using Icepak 4.0 Icepak 4.0, the newest
version of Fluent’s electronics cooling simulation software, was
released to users in June. This new version of Icepak delivers the industry’s
fastest time-to-solution through a combination of new technologies and
a redesigned, time-saving interface.
Several key features have been introduced in Icepak 4.0. The new assembly
meshing capability delivers the power of FLUENT’s long-standing ability
to solve problems on meshes with non-conformal interfaces. This allows
geometric details to be included in the model without imposing the penalty
of large cell counts. In some cases studied, the mesh size can be reduced
by 20 to 70%. This decreases solution time, design time, and project costs,
allowing the designer to build an accurate, yet computationally efficient
model faster than can be done with any other thermal management software
package on the market today. A number of users have been impressed with
the new assembly meshing capability. Dr. Sam Zhao, a senior engineer with
Broadcom, explains that non-conformal meshing is “especially desirable
for large electronic system simulations where detailed thermal models
of devices are necessary for improved accuracy in junction temperature
predictions.”
A benchmark computer chassis solution, computed using Icepak 4.0
The number of other enhancements
abound, and include a new interface that allows
the user to build and assemble models with
ease, a graphical “tree” that allows the user
to manage and organize projects, the ability
to create custom libraries of different parts
and populate them using “drag and drop”
functionality, the inclusion of standard library
parts for fans and IC (integrated chip) packages,
and new graphical alignment tools.
Advanced object wizards and macros are also
included that allow the user to build either
components or entire benchmark systems.
The ability to model heat exchangers or cold
plates using 1D networks has been introduced,
as has a modified IDF (Intermediate Data Format)
import capability that allows the user to customize
the import of detailed board level models.
These features combine to deliver
unprecedented flexibility and power to the
electronics designer.
Along with the Icepak 4.0 release is the
Version 3.0 release of the Icepak to ProE direct
CAD interface, now called IcePro3.0. This product
contains features that significantly reduce
the time required to transfer a CAD model
from ProE to Icepak. For example, faster model
import is achieved in part through elimination
of the surface abstraction process. In addition,
any material information specified in the
ProE model is now imported into Icepak as
a custom material, with all property data included
in the transfer.
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