The geometry of the unit, imported from Pro-Engineer ™

Engineers at Global Manufacturers' Services Valencia S.A. design group in Spain have used Icepak to perform a thermal analysis of an enclosed electronic system. The objective of the study was to understand the role of natural convection in the removal of heat from some of the components. Of particular interest were two MOSFETs, or metal-oxide-semiconductor field-effect transistors, each of which dissipates 23 watts of heat during normal operation. The MOSFETs are mounted one above the other, and are both attached to an extruded heat sink that is positioned on a vertical wall of the enclosure box.

Flow-field results show natural convection currents in the vicinity of the lower transistor being heated, and rising toward the upper transistor. These air currents act to cool the power-dissipating devices. Since the cooling air near the upper transistor is warmer than that near the lower one, the efficiency of cooling is reduced, and the upper transistor operates at a higher temperature than the lower one. Icepak simulations were performed to improve the system design. The results showed that by increasing the size of the heat sink used, the operating temperatures of both MOSFETs could be reduced. The simulations also demonstrated that voltage regulators, located at the top of the box enclosure, were not compromised by the natural-convection currents that caused warm cooling air to migrate upward.

The temperature distribution on the heat sink cover shows the two MOSFETs, with the upper one at a slightly higher temperature than the lower one

The set of simulations performed was typical of the services offered by Global Manufacturers' Services. Clients benefit from the group's design and analysis simulation capabilities in both mechanical and electronics engineering. When the simulations require thermal analysis of electronics components, the company has found Icepak to be an invaluable tool for predicting and conveying results to its customers.

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